منابع مشابه
Wire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
متن کاملOverview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
متن کاملWire Bonding – A Closer Look
Just like soldering, wire bonding appears to be a simple process and is frequently taken for granted. People tend to think all that is required to have a high quality bonding process is a simple wire pull test to monitor and control the process. But like soldering, this process is complex and requires a thorough understanding of the metallurgy, thermodynamics, and surface chemistry involved. Th...
متن کاملTwo capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding
In this article, the new challenges and requirements in wire bonding are discussed, the problems in ultra-fine-pitch wire bonding and insulated wire bonding are analyzed, and then two capillary solutions to the problems are presented. Actual bonding experiments using the new capillaries were carried out and the results were satisfactory. Compared to the standard design, a new capillary design h...
متن کاملDigital Control of Bonding Force for Gold Wire Bonding Machine
In order to digitally control the bonding force of a wire bonder precisely, this paper uses a DC solenoid as a force source, and by controlling the solenoid’s current, which causes the electromagnetic force, we can control the bonding force that capillary applies. The bonding force control system in this paper is composed of PC (Personal Computer) and hypogyny MCU (Micro Controller Unit), which...
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ژورنال
عنوان ژورنال: Journal of SHM
سال: 1993
ISSN: 1884-1198,0919-4398
DOI: 10.5104/jiep1993.9.4_30