Atomic layer deposition of tin oxide and zinc tin oxide using tetraethyltin and ozone

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Incomplete elimination of precursor ligands during atomic layer deposition of zinc-oxide, tin-oxide, and zinc-tin-oxide.

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Low Temperature Atomic Layer Deposition of Tin Oxide

Atomic layer deposition (ALD) of tin oxide (SnOx) films was achieved using a newly synthesized tin precursor and hydrogen peroxide. We obtained highly pure, conductive SnOx films at temperatures as low as 50 C, which was possible because of high chemical reactivity between the new Sn precursor and hydrogen peroxide. The growth per cycle is around 0.18 nm/cycle in the ALDwindow up to 150 C, and ...

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Atomic Layer Deposition of Tin Oxide with Nitric Oxide as an Oxidant Gas

Atomic layer deposition (ALD) of tin oxide (SnO2) thin films was achieved using a cyclic amide of Sn(II) (1,3-bis(1,1-dimethylethyl)4,5-dimethyl-(4R,5R)-1,3,2-diazastannolidin-2-ylidene) as a tin precursor and nitric oxide (NO) as an oxidant gas. Film properties as a function of growth temperature from 130–250 C were studied. Highly conducting SnO2 films were obtained at 200–250 Cwith the growt...

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ژورنال

عنوان ژورنال: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

سال: 2015

ISSN: 0734-2101,1520-8559

DOI: 10.1116/1.4907562