Assembly of Metal–Phenolic Networks on Water‐Soluble Substrates in Nonaqueous Media

Abstract Interfacial modular assemblies of eco‐friendly metal–phenolic networks (MPNs) are interest for surface and materials engineering. To date, most MPNs assembled on water‐stable substrates; however, the self‐assembly highly water‐soluble substrates remains unexplored. Herein, a versatile approach is reported to engineer thickness‐tunable coatings (2–25 µm) substrate (i.e., urea) via in nonaqueous solvent acetonitrile). The coordination‐driven assembly MPN distinct from that aqueous systems, as only achieved following addition urea granules into iron–tannin solution. coating occurs relatively rapidly (5–60 min), generating micrometer‐thick adsorption Fe III –TA complexes micrometer‐sized particles formed straightforward nature present fabrication method thick robust with high stability environments (including at 60 °C) coupled broad range available naturally abundant polyphenol–metal ion combinations expand applicability materials, thus providing new opportunities their broader application industrial processes applications.