Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics

Abstract Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide conductive layer, but there limited understanding of how surface topography glass substrate affects copper/glass bonding strength exhibited current literature. A laser ablation technique was prepare surfaces with micro-scale structured features this study, these were characterized quantitatively using areal texture parameters. The adhesion quantified a scratch testing technique, relationships between critical loads measured parameters, well discussion underlying mechanisms, are presented report. Statistical analysis employed identify most relevant parameters that may be prediction design promoting textures. experimental results suggest significant consider Sq , Sdq Sdr Sxp Vv Vmc Vvc, recommended value range each parameter optimal performance given.