An Energy-Efficient and Bandwidth-Scalable DWDM Heterogeneous Silicon Photonics Integration Platform

Heterogeneous III-V-on-silicon photonic integration has proved to be an attractive and volume manufacturable solution that marries the merits of III-V compounds silicon technology for various integrated circuit (PIC) applications. The current main-stream Ethernet trends larger bandwidth are pushing higher modulation baudrate or employing advanced format datacom However, neither is likely able significantly drive overall cost energy efficiency best sweet spot, nor unfold full potential heterogeneous integration. Here we review our innovations on a special platform, development dense wavelength division multiplexed (DWDM) transceiver. A 40-channel DWDM architecture platform fabrication discussed first, followed by experimental demonstration each high-quality building block. InAs/GaAs quantum dot material choice robust multi-wavelength lasers, amplifiers, high-speed avalanche photodetectors (APDs) which complements more mature SiGe APDs. metal-oxide-semiconductor capacitor phase shifter mission critical structure provide athermal efficient tuning deinterleavers microring resonators, modulation. successful 8 × 25 Gb/s link paves way world's first fully-integrated PIC Si with Terabit/s aggregated ∼100 fJ/bit.