Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays

Abstract In this paper we present an optimized manufacturing technique for special long-wavelength 1-dimensional and 2-dimensional Vertical Cavity Surface Emitting Laser Diode (VCSEL) arrays with focus on die bonding a wire process as well additional possibilities to make the more productive increase product quality, reliability, life time. VCSEL have very broad application potential. Objective of is development assembly technology high positioning accuracy automated production total yield, using gold-based conductive glue (because silver migration concern) securing yield extremely reliability lifetime. Due customer requirements, final thickness 35 micron low standard deviation necessary. For highest gold top side contact silicon substrate metallization has been requirement. With described develop produce specific products dedicated wavelength, performance, packaging options. Bases our findings, flexible scalable solutions are possible, matching many different applications. Finally, will overview results physical electro-optical characterization devices. This yielded technique, meeting requirements mentioned above. Special design features ensure that relatively thermal resistance cured layer does not impair properties or lifetime VCSELs. interconnection used 20 microns diameter, ball-wedge, Stand-Off Stich Bond loop geometry, required by customer. semiconductor material VCSELs temperature required, enabled process. Gold delivered excellent results, far exceeding specification. The optical spectrum other measurements indicate processes do harm laser diodes their properties. All met. burn-in data furnished proof quality engineered technology. technologies developed current enable new devices huge amount applications because novel innovative arrays.