Adhesion of HIPIMS-Deposited Gold to a Polyimide Substrate

Gold is the preferred material for conductive structures in neural implants. The hitherto employed process applies adhesive layers to avoid delamination of gold from a polymeric substrate. possibility deposit without use offered by high-power impulse magnetron sputtering (HIPIMS) process. In this work, it shown that possible utilize HIPIMS onto polyimide while having enough adhesion between these two omit an layer. A scratch test was performed demonstrate adherence layers.