Additively Manufactured Extreme Temperature Electronics Packaging

Abstract There is growing interest in extreme temperature electronics to support the mission needs sense, actuate, and communicate at temperatures beyond normal range of operations commercial military applications. Reliable packaging more than 300°C has been demonstrated using ceramic multi-chip modules conventional hybrid circuit technology. This approach typically requires high NRE costs lead time. Additive manufacturing processes metals, ceramics, conductors, dielectrics provides a digital transformation technology that reduces time cost for with added benefits novel 3D structures embedded features. report presents results testing characterize important electrical mechanical properties additively manufactured materials (substrates, conductor, dielectrics) die interconnect methods needed 300 750 °C electronic designs.