Accurate measurement of thin film mechanical properties using nanoindentation

Abstract For decades, nanoindentation has been used for measuring mechanical properties of films with the widely assumption that if indentation depth does not exceed 10% film thickness, substrate influence is negligible. The rule was originally deduced much thicker metallic on steel substrates and involved only hardness measurement. Thus, boundaries usability thin elastic modulus may differ. Two known material systems Mo MoTa Si are examined numerical modeling to show limitations in moduli. An assessment as a function contact accurate film/substrate deformation confirms measurements. modulus, depths should be smaller. Results provide recommended testing protocol using nanoindentation. Graphical abstract