Accurate Cure Modeling for Isothermal Processing of Fast Curing Epoxy Resins

Cold-Curing Structural Epoxy Resins: Analysis of the Curing Reaction as a Function of Curing Time and Thickness

The curing reaction of a commercial cold-curing structural epoxy resin, specifically formulated for civil engineering applications, was analyzed by thermal analysis as a function of the curing time and the sample thickness. Original and remarkable results regarding the effects of curing time on the glass transition temperature and on the residual heat of reaction of the cold-cured epoxy were ob...

Optimization of thermal curing cycle for a large epoxy model

Heat generation in an exothermic reaction during the curing process and low thermal conductivity of the epoxy resin produces high peak temperature and temperature gradients which result in internal and residual stresses, especially in large epoxy samples. In this paper, an optimization algorithm was developed and applied to predict the thermal cure cycle to minimize the temperature peak and the...

Effect of cure cycle on curing process and hardness for epoxy resin

A 3-dimensional finite element model is developed to simulate and analyze the temperature and degree of cure field of epoxy casting part during cure process. The present model based on general finite element software ABAQUS is verified by literature example and experimental data. The numerical results show good agreement with literature example and measured data, and are even more accurate than...

Curing and thermal behavior of epoxy resins of hexafluoro - bisphenol – A and bisphenol - A

This paper describes the synthesis and characterization of epoxy resins based on (hexafluoroisopropylidene)diphenol (EFN) and p,p’-isopropylidenebisphenol (EBN), respectively and 4, 4’(hexafluoroisopropylidene)dipthalic-imideamine (IMAM), a curing agent. The synthesized epoxy resins and IMAM curing agent were characterized by Fourier Transform Infrared (FTIR) and 1H Nuclear Magnetic Resonance (...

Curing of epoxy resins with PF novolacs in the presence of copper diacetyl acetonate