A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers
نویسندگان
چکیده
منابع مشابه
Diffusion bonding of hardmetals (WC-Co) with metallic interlayers
Diffusion bonding of hardmetals (WC-Co) to themselves or with other metallic material (mildsteel) has been evaluated in the present paper. Metallographic studies and mechanical tests have been used to determinate the influence of the bonding parameters (temperature, pressure and time) on the bond microstructure and strength. Different metallic interlayers applied in form of thick foils were use...
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ژورنال
عنوان ژورنال: Coatings
سال: 2018
ISSN: 2079-6412
DOI: 10.3390/coatings8110401