A coupled plasticity-damage cohesive-frictional interface for low-cycle fatigue analysis

Coupled Plastic Damage Model for Low and Ultra-low Cycle Seismic Fatigue

This paper presents the theoretical framework for a coupled plastic damage constitutive model valid for materials subjected to cyclic loads that lead to low and ultra-low cycle fatigue. Two numerical examples were presented in order to illustrate the behaviour of the model and its capabilities.

Evaluation of continuum damage at different temperatures for aluminum-silicon alloy of engine piston within low-cycle fatigue regime

In this article, the isothermal low-cycle fatigue continuum damage in the engine piston aluminum alloy has been evaluated at different temperatures. For this objective, experimental data of low-cycle fatigue tests on standard specimens were used at 280, 350 and 425°C. Based on the continuum damage mechanics method, the fatigue damage was calculated during cyclic loading. Obtained results, inclu...

Cohesive, frictional powders: contact models for tension

The contacts between cohesive, frictional particles with sizes in the range 0.1–10μm are the subject of this study. Discrete element model (DEM) simulations rely on realistic contact force models—however, too much details make both implementation and interpretation prohibitively difficult. A rather simple, objective contact model is presented, involving the physical properties of elastic–plasti...

Analysis of Ultra Low Cycle Fatigue Problems with the Barcelona Plastic Damage Model

A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects

Below certain length scales and in the presence of a non-uniform plastic strain field the mechanical behavior of many metals and its alloys is substantially different from that in bulk specimens. In particular, an increase in resistance with decreasing size has been observed in Pb/Sn eutectic solder alloys which are extensively used in microelectronics packaging interconnects. Due to the high h...