150 mm SiC Engineered Substrates for High-Voltage Power Devices

نویسندگان

چکیده

Silicon Carbide (SiC) Power Devices have emerged as a breakthrough technology for wide range of applications in the frame high power electronics. Despite continuously improving quality and supply 4H-SiC substrates, availability such wafers is still insufficient. An advantageous opportunity offered by Smart Cut TM with integration very SiC layer transferred to low resistivity handle wafer. This bi-layer material enables significant yield optimization improvement device’s electrical performance. Moreover, an additional key feature possibility re-use multiple times donor wafer, leading reduced manufacturing costs enabling volume production wafers. In this paper we report latest advances development so called SmartSiC substrates.

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ژورنال

عنوان ژورنال: Materials Science Forum

سال: 2022

ISSN: ['1422-6375', '0250-9776', '0255-5476', '1662-9752', '1662-9760']

DOI: https://doi.org/10.4028/p-mxxdef