This work presents an add-on result of cross-linking using photoacoustic spectroscopy (PAS) phases in a multivariable process using the phase-resolved photoacoustic (PRPA) method. The method is tested to separate contributions from groupings -OH, -CH(2)-, -CH(3), and Si-OH overtones in the range from 700 to 2600 nm. Samples of the copolymers ethylene vinyltrimethoxysilane (EVS) and grafted viny...

Poly(lactic acid) (PLA)/palygorskite (Paly) nanocomposites were prepared using the melt compounding technique. Paly modified by 3-aminopropyltriethoxysilane (APTES) and vinyltrimethoxysilane (VTMS) was used as nanofiller for PLA with concentrations in 1–7 wt% range. It has been found that functionalization allows a covalent bond between hydroxyl groups of matrix, evidenced improvement mechanica...

Poly(methyl acrylate) (PMA) + SiO2 composites were synthesized via a sol-gel reaction. The base acrylic copolymers with a content of alkoxysilane groups were prepared by co-polymerization of methylacrylate (MA) with 3-(trimethoxysilyl) propylmethacrylate (3MPS) or vinyltrimethoxysilane (VTMS); the products were cocondensed with tetraethylorthosilicate (TEOS). The PMA + SiO2 hybrids were charact...

Friedel-Crafts alkylation reaction of vinyltri-methoxysilane with styrene was performed in the pres-ence anhydrous AlCl3. Alkoxy(4-vinylphenethyl)silane has been obtained. The synthesized products were identified by 1H, 13C, COSY NMR, and FTIR spectroscopy. Calculations using quantum-chemical non-empirical density functional theory (DFT) method for between vinyltrimethoxysilane ortho-, meta- pa...

The hydrosilylation reaction is a dominant curing method for the light-emitting diode (LED) silicone encapsulant, which requires characteristics of high transparency, high refractive index, and thermal stability against the LED junction temperature. In this research, we synthesized a hydrogen containing oligosiloxane resin through non-hydrolytic sol–gel condensation. Methyldiethoxysilane (MDES)...

Abstract High integration and miniaturization of electronic systems require thermal conductivity mechanical damping materials. In this study, hexagonal boron nitride ( h BN) particles were modified by vinyltrimethoxysilane (V171) hexadecyltrimethoxysilane (N3116) for comparing, described as V171- BN N3116- BN, respectively. The pristine surface filled in vinylmethylpolysiloxane (VMQ), then vulc...