Two thermal challenges for current and next generation microelectromechanical systems (MEMS) applications are discussed. The first topic is the fundamental investigations of phase change phenomena in the microscale. It has been demonstrated that microresistive heaters can generate single, spherical and controllable thermal bubbles with diameters between 2 and 500 mm. Both simplified steady stat...

This paper proposed a half-experimental model to reconstruct the die-bonding thermal path of highpower light-emitting diodes (HP-LEDs). In this model, the partially insufficient filling of bonding materials and their directional/random distributions (“filling state” for short) have been taken into consideration. Both the silver-paste structure and the Au/Sn-eutectic structure were analyzed and ...

The shear bonding strengths of a veneering resin to polished, sandblasted, and retention bead-cast commercially pure titanium (cpTi) plates with and without alkaline treatment were measured before and after thermal cycling. The bonding strengths to polished cpTi with and without alkaline treatment decreased remarkably with thermal cycling (p<0.01). The bonding strength to sandblasted cpTi with ...

Thick bonding wires are used in modern power modules as connectors between integrated circuits, carrying current from one circuit to another. They experience high values of current, which generates heat through Joule heating and can lead to various failure mechanisms. Typically used wire materials in industry are aluminum (Al), copper (Cu), and intermetallic compounds of Cu-Al. They are broadly...

Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the...

Diffusion bonding has been widely used within microlamination architectures for the fabrication of Micro Energy and Chemical Systems (MECS). MECS are microsystems with the ability to process bulk amounts of fluid within highly-parallel microchannel arrays capable of accelerated heat and mass transfer. Thus far, diffusion bonding of the microchannel arrays is commonly done in a vacuum hot press ...

In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results showed that the temperature for maximum decomposition rate of ACF, Tm decreased with increasing bonding temperature. The resu...

We discovered that poly(vinylphenol) (PVPh) possesses an extremely low surface energy (15.7 mJ/m2) after a simple thermal treatment procedure, even lower than that of poly(tetrafluoroethylene) (22.0 mJ/m2) calculated on the basis of the two-liquid geometric method. Infrared analyses indicate that the intermolecular hydrogen bonding of PVPh decreases by converting the hydroxyl group into a free ...

We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bon...