In this paper, the operation of S-G pair TSV,coaxial TSV, tapered S-G pair TSV and tapered coaxial TSV are analyzed where the TSV resistance, inductance, and capacitance need to be modeled to find out their impact on the performance of a 3-D circuit. The RLC parameters of the TSV are modeled as a function of physical factor and material characteristics. The performance of the analytically model...

Through-Silicon Via (TSV) is a critical interconnect element in 3D integration technology. TSVs introduce many new design challenges. In addition to competing with devices for real estate, TSVs can act as a major noise source throughout the substrate. We present in this paper a comprehensive study of TSV-induced noise as a function of several critical design and process parameters including sub...

during 2007-2008 growing season, a total of 520 sunflower leaf samples with symptoms like vein clearing, cholorotic and necrotic local lesion, deformation and stunting which were suspected of being infected with tobacco streak virus (tsv) were collected from sunflower fields of azarbayijan-gharbi, isfahan, qom, markazi, tehran and hamedan provinces. infection with tsv in collected samples were ...

Power supply noise in three-dimensional integrated circuits (3-D ICs) considering scaled CMOS and through silicon via (TSV) technologies is the focus of this paper. A TSV and inductance aware cell-based 3-D power network model is proposed and evaluated. Constant TSV aspect ratio and constant TSV area penalty scaling, as two scenarios of TSV technology scaling, are discussed. A comparison of pow...

It is widely-known that coupling exists between adjacent through-silicon vias (TSVs) in 3D ICs. Since this TSVto-TSV coupling is not negligible, it is highly likely that TSVto-TSV coupling affects crosstalk significantly. Although a few works have already analyzed coupling in 3D ICs, they used Sparameter-based methods under the assumption that all ports in their simulation structures are under ...

This study evaluated the susceptibility of Penaeus vannamei, Kona stock-line, to infection by an isolate of Taura syndrome virus from Belize (TSV-BZ) under hyperthermic conditions (32 degrees C). Shrimp exposed to the reference Hawaii-94 isolate of TSV (TSV-HI) showed resistance to infection at 32 degrees C as demonstrated by the absence of mortality, histopathological lesions and decreased vir...

Ganglioside patterns of a cloned Simian virus 40- (SV40) induced hamster tumor cell (Cl(2)TSV(5)-S), its normal variant (Cl(2)TSV(5)-R) which are Cl(2)TSV(5)-S gradually adapted to grow in the presence of 2 microg/ml actinomycin D and exhibit certain normal phenotypic characteristics, and its back variant (Cl(2)TSV(5)-RR), which are Cl(2)TSV(5)-R cells grown in the absence of actinomycin D for ...

Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies. One of the hottest topics in the semiconductor industry today is a 3D packaging using Through Silicon Via (TSV) technology. Driven by...

Taura syndrome virus (TSV), a pathogen of penaeid shrimp and member of the family Dicistroviridae, was recently reported to have the ability to infect primate cells. We independently retested this hypothesis. Three lines of primate cells FRhK-4, MA-104, and BGMK, which are highly susceptible to infection by human picornaviruses, were challenged with TSV. Viral replication was assayed by real-ti...

Acknowledgments First, I would like to thank Professor Eby G. Friedman, my research and thesis adviser throughout my master's studies. It is his brilliant suggestion and patient guidance on my research that makes this work possible. His character of responsibility and wisdom on life deserves my study for my entire life. I appreciate the opportunity to work with Professor Eby G. Friedman and for...