the mixed-signal circuits with both analog and digital blocks on a single chip have wide applications in communication and rf circuits. integrating these two blocks can cause serious problems especially in applications requiring fast digital circuits and high performance analog blocks. fast switching in digital blocks generates a noise which can be introduced to analog circuits by the common su...

a fourth-degree substrate integrated waveguide (siw) crossed coupled band pass filter for wlan band is designed by using a new negative coupling structure. it consists of two u shape microstrip lines on top and bottom planes with via holes at the center of them. this paper investigates the phase characteristics of negative and positive coupling structures and their effects. the design, fabricat...

Substrate noise generated by digital circuits on mixed-signal ICs can disturb the sensitiveanalog/RF circuits, such as Low Noise Amplifier (LNA), sharing the same substrate. This paperinvestigates the adverse impact of the substrate noise on a high frequency cascode LNA laid out on alightly doped substrate. By studying the major noise coupling mechanisms, a new and efficientmodeling method is p...

This paper presents an efficient modeling method, based on the microstrip lines theory, for the coupling between a sub­strate backplane and a device contact. We derive simple closed-form formulas for rapid extraction of substrate parasitics. We use these formulas to model spiral inductors as important substrate-noise sources in mixed-signal systems. The proposed model is verified for the freque...

A fourth-degree Substrate Integrated Waveguide (SIW) crossed coupled band pass filter for WLAN band is designed by using a new negative coupling structure. It consists of two U shape microstrip lines on top and bottom planes with via holes at the center of them. This paper investigates the phase characteristics of negative and positive coupling structures and their effects. The design, fabricat...

A measurement method is proposed to characterize the substrate coupling between digital and analog sections of a mixed-signal CMOS chip. Induced noise and spurious signals can be measured by a custom-designed analog sensor. This paper proposes a method that, when given such a sensor, allows to measure the crosstalk between digital and analog chip sections. Calibrated sampling scope measurements...

Substrate coupling in integrated circuits is the process whereby parasitic current flow in the substrate electrically couples devices in different parts of the circuit. Higher levels of integration and higher frequencies of operation make the coupling more pronounced in modern circuit realizations. High levels of integration are desirable in several applications for reducing the overall power d...

levels of circuit functionality in chips designed for compact consumer electronic products and the widespread growth of wireless communications have triggered the proliferation of mixed analogdigital systems. Single-chip designs combining digital and analog blocks built over a common substrate feature reduced levels of power dissipation, smaller package counts, and smaller package interconnect ...

Substrate noise effects caused by the integration of a DC-DC converter into a 0.13 μm CMOS technology integrated circuit are investigated in this paper. Simulations performed using the Substrate Noise Analyst tool show strong impact of switching and power supply noise on a sensitive analog block. The dependence of substrate noise coupling on physical separation distance, floorplanning and intro...