Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. ...

Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and f...

STATEMENT OF PROBLEM It is not known whether different high-palladium alloys of similar composition possess comparable tensile strength properties associated with connector soldering. PURPOSE The purpose of this study was to evaluate the tensile strength properties of 2 high-palladium alloys on soldered connectors under simulated pre-ceramic and post-ceramic soldering conditions. MATERIAL A...

Surface mount technology (SMT) is increasingly used in microelectronics to mount components by soldering onto the printed circuit board (PCB). The solder alloys are used as the electrical and mechanical connections between the component and the board. Fatigue failure of solder joints is recognized as a major cause of failure in electronic devices. An approach to this problem is to determine the...

Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/subs...

The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb contain...

The near eutectic 60%-40Pb alloy is the most commonly used solder for electrical interconnections in electronic packages. This alloy has a number of processing advantages (suitable melting point of 183°C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and fail...

In this study, an addition of Ag micro-particles (8–10 lm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-com...

The effect of Ni impurity on the self-diffusivity of bSn in the (1 0 1) symmetric tilt grain boundary is investigated. Using molecular dynamics simulations over a temperature range of 300–450 K. It is shown that Ni solute decreases the grain boundary self-diffusivity of bSn as the amount of solute in grain boundary increases. We also study the solute effect on the diffusive width of grain bound...