The Performance of electric vehicle IGPT Pin fin heat sink can be measured by the temperature field and the fluid pressure and other parameters. In order to improve the cooling effect of Pin fin heat sink, diameter, length and distance of the fin was optimized combination. The relationship between pressure drop of the water inlet, outlet and pin fin parameters was analyzed and calculated. It wa...

A three-dimensional numerical model of thermoelectric generator (TEG) modules attached to a large chimney plate is proposed and solved numerically using a control volume based finite difference formulation. The TEG module consists of a thermoelectric generator, an elliptical pin-fin heat sink, and a cold plate for water cooling. In the chimney, the temperature of flue gases is 450-650K. Althoug...

Steady heat transfer through a pin fin is studied. Thermal conductivity, heat transfer coefficient, and the source or sink term are assumed to be temperature dependent. In the model considered, the source or sink term is given as an arbitrary function. We employ symmetry techniques to determine forms of the source or sink term for which the extra Lie point symmetries are admitted. Method of sep...

An analysis of the effect of orientation on the heat transfer in a scaled model pin fin heat sink utilized in Light Emitting Diode (LED) lighting has been carried out using numerical method. The present study involves natural convective heat transfer that takes place in particular heat sink. A pin fin type heat sink has been studied since they are widely used in LED lighting systems which in tu...

Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 Comparative thermal tests have been carried out using aluminum heat sinks made with extruded fin, cross-cut rectangular pins, and elliptical shaped pins in low air flow environments. The elliptical pin heat sink was designed t...

Particle swarm optimization (PSO) is employed to investigate the overall performance of a pin fin.The following study will examine the effect of governing parameters on overall thermal/fluid performance associated with different fin geometries, including, rectangular plate fins as well as square, circular, and elliptical pin fins. The idea of entropy generation minimization, EGM is employed to ...

Heat sinks are used in industrial equipment to dissipate the excess heat from their heat-generating parts to the ambient. In the last few years, efforts on manufacturing electronic or mechanical devices with less weight, space, and lower cost were spent. Heat dissipation from the heat sink is stalling a big problem which many researchers are trying to solve. The aim of this study is to brief th...

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each with a nominal pin height of 200 lm and pin diameters of 90 lm and 30 lm. Singlephase and two-phase thermal testing of the micropin-fin array heat sinks were performed using de-ionized (DI) water as the coolant. The te...