نتایج جستجو برای: Interfacial bonding

تعداد نتایج: 64652  

2017
Jianmei Wang Quanzhi Xia Yang Ma Fanning Meng Yinan Liang Zhixiong Li

To investigate the performance of bonding on the interface between ZChSnSb/Sn and steel body, the interfacial bonding energy on the interface of a ZChSnSb/Sn alloy layer and the steel body with or without Sn as an intermediate layer was calculated under the same loadcase using the molecular dynamics simulation software Materials Studio by ACCELRYS, and the interfacial bonding energy under diffe...

Journal: :Journal of the American Chemical Society 2006
Teresa L Tarbuck Stephanie T Ota Geraldine L Richmond

Measuring the molecular properties of the surface of acidic and basic aqueous solutions is essential to understanding a wide range of important biological, chemical, and environmental processes on our planet. In the present studies, vibrational sum-frequency spectroscopy (VSFS) is employed in combination with isotopic dilution experiments at the vapor/water interface to elucidate the interfacia...

Journal: :Applied spectroscopy 2010
Cathryn L McFearin Geraldine L Richmond

The molecular bonding and orientation of water at the chloroform-water interface has been examined in this study using vibrational sum-frequency spectroscopy (VSFS). The results provide a key puzzle piece towards our understanding of the systematic changes in the interfacial bonding and orientation of water that occur with variations in the polarity of the organic phase, especially when compare...

2017
A. N. Caruso Ligen Wang Sitaram Jaswal Evgeny Y. Tsymbal Peter A. Dowben

The bonding strength and interfacial electronic properties of biphenyldimethyldithiol (HS– CH2–C6H4–C6H4–CH2–SH) adsorbed on Au(111) and polycrystalline cobalt are identifi ed from combined photoemission and inverse photoemission. In order to develop a better understanding of the thiol functional group to metal surface interaction, the stable orientation, bonding site, bonding strength and inte...

Journal: :journal of dentistry, tehran university of medical sciences 0
pallavi vashisth department of pedodontics, institute of dental sciences, bareilly, up, india. mudit mittal department of periodontology, kothiwal dental college, moradabad, up, india. mousumi goswami professor, department of pedodontics, its dental college, greater noida, up, india. seema chaudhary professor, department of pedodontics, kothiwal dental college, moradabad, up, india. swati dwivedi department of pedodontics, institute of dental sciences, bareilly, up, india.

to evaluate the interfacial morphology and the bond strength produced by the three-step, two-step and single-step bonding systems in primary teeth.occlusal surfaces of 72 extracted human deciduous teeth were ground to expose the dentin. the teeth were divided into four groups: (a) scotchbond multipurpose (3m, espe), (b) adh se (vivadent), (d) optibond all-in-one (kerr) and (e)futurabond nr (voc...

2017
Yibo Sun Feng Wang Xinhua Yang

Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS) with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer components is related to the interfacial fusion, which can be used as a monitoring parameter to control ultrasonic energy. To study the vibrat...

Journal: :Angewandte Chemie International Edition 2016

2010
Zhao Zhang Teng Li

The graphene morphology regulated by nanowires patterned in parallel on a substrate surface is quantitatively determined using energy minimization. The regulated graphene morphology is shown to be governed by the nanowire diameter, the nanowire spacing, and the interfacial bonding energies between the graphene and the underlying nanowires and substrate. We demonstrate two representative regulat...

Journal: :CoRR 2006
Ja-Myeong Koo Seung-Boo Jung

Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bon...

Journal: :Annals of Japan Prosthodontic Society 2012

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