A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cell microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inle...

Higher-powered electronics are being integrated into automobiles rapidly. With these electronics comes a problem of how to cool this equipment economically. Heatsink costs have not benefited nor adapted to the high volume nature of automotive electronics. Specially shaped heatsinks are much more efficient for a given size than aluminum extrusion-based ones, most prevalent used in automobiles. H...

This quick calculation implies that the only way to achieve the rated maximum power dissipation is to have a “perfect heatsink” or an “infinite heatsink.” The thermal impedance used in the calculation is from the junction to case only and assumes zero impedance into the ambient. This is practically impossible to achieve. Further, the ambient was assumed to be 25C (room temperature) which may no...

High purity aluminum has always been a good heatsink material for removing heat from electronic components. However, the manufacturing of specialty shaped, non-extrusion based heatsinks, causes many material-based problems. High purity aluminum is very difficult to die cast and impurities must normally be added to aid in the die casting process. These small amounts of impurities cause the therm...

Power dissipation of chips has been raising faster than the technology needed to economically cool them. Especially in the high performance arena. To get high efficiency heatsinks presently, extrusions are machined or entire heatsinks are machined with strategically arranged fins. These methods are not as effective in high component densities or cost sensitive units compared to newer, porosity ...

Generally in a white light-emitting diode (LED), a phosphor slurry is placed around the semiconductor chip or the phosphor is conformally coated over the chip to covert the narrowband, short-wavelength radiation to a broadband white light. Over the past few years, the remote-phosphor method has provided significant improvement in overall system efficiency by reducing the photons absorbed by the...

New design, experimental and numerical efforts, optimization and manufacturing process constitute the elements of investigation of this paper. The fundamental objective of the present study is to compute the thermal dissipation capability of a new design constructed for copper heatsinks and also deals with challenges in manufacturing of these components. A part of experimental efforts are condu...

In this paper, three-dimensional finite element analysis using the commercial ANSYS software is performed to study the thermal performance of a thermally enhanced FC-PBGA (flip-chip plastic ball grid array) assembly in both natural and forced convection environments. The thermally enhanced FC-PBGA assembly is a basic FC-PBGA assembly with a lid attached on top, after which an extruded-fin heats...

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thinfilm interface is wirebondable and solderable, and consists of three layer...

In various applications, thermoelectric active cooling systems can help maintain electronic devices at a desired temperature condition better than passive coolers. Thermoelectric Coolers (TEC) are especially useful when the temperature of a device needs to be precisely controlled. This study proposes a user-friendly graphical method for calculating the steady-state operational point of a TEC ba...