cu-mo and cu-ti contact structures were fabricated on multi-crystalline silicon substrates to provide a low resistance ohmic contact. deposition steps are done in an excellent vacuum chamber by means of electron beam evaporation and samples are then annealed for the realization of an efficient alloy layer. the effects of process parameters such as film thickness, annealing duration and temperat...

Cu-Mo and Cu-Ti contact structures were fabricated on multi-crystalline silicon substrates to provide a low resistance ohmic contact. Deposition steps are done in an excellent vacuum chamber by means of electron beam evaporation and samples are then annealed for the realization of an efficient alloy layer. The effects of process parameters such as film thickness, annealing duration and temp...

Ohmic contacts to thin-film CdS/CdTe photovoltaic devices have been formed using a two-layer contact interface of undoped ZnTe (ZnTe) and Cu-doped ZnTe (ZnTe:Cu), followed by Ni or Ti as an outer metallization. Secondary ion mass spectroscopy (SIMS) is used to study Cu diffusion within this back-contact structure, and also, to monitor Cu diffusion from the contact into the CdTe. When Ni metalli...

Biomedical materials can improve the life quality of a number of people each year. The range of applications includes such as joint and limb replacements, artificial arteries and skin, contact lenses, and dentures. So far the accepted biomaterials include metals, ceramics and polymers. The metallic biomaterials mainly contain stainless steel, Co-Cr alloys, Titanium and Ti-6Al-4V. Recently, bulk...

The integration of Cu interconnections will require sophisticated structures to prevent Cu from coming into contact with devices. The barriers for Cu also must have good adhesion with dielectric and Cu, and yield desirable microstructure of Cu. This paper discusses several critical barrier requirements and compares the properties of Ta and Ti/TiN barrier systems.

In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory allo...

In this paper, we predict the current-voltage (I-V) characteristics and contact resistance of “end-contacted” metal electrode-graphene and metal electrode-carbon nanotube (CNT) interfaces for five metals, Ti, Pd, Pt, Cu, and Au, based on the first-principles quantum mechanical (QM) density functional and matrix Green’s function methods. We find that the contact resistance (normalized to surface...

Copper (Cu) could be suitable to create anti-infective implants based on Titanium (Ti), for example by incorporating Cu into the implant surface using plasma immersion ion implantation (Cu-PIII). The cytotoxicity of Cu might be circumvented by an additional cell-adhesive plasma polymerized allylamine film (PPAAm). Thus, this study aimed to examine in vivo local inflammatory reactions for Ti6Al4...

The study was designed to investigate the synergic effect of Ti and Sn in active metal brazing Al2O3 ceramic copper brazed, using multicomponent Ag-Cu-Zr filler alloy. Numerous fine hexagonal-shaped rod-like ternary intermetallic (Zr, Ti)5Sn3 phase (L/D = 5.1 ± 0.8, measured microns) were found dispersed Ag-Cu matrix Ag-18Cu-6Sn-3Zr-1Ti alloy, along with CuZrSn phases. An approximate 15° reduct...

An environmentally benign Cu-Ce-Ti oxide catalyst exhibited excellent NH3-SCR activity, high N2 selectivity and strong resistance against H2O and SO2 with a broad operation temperature window. The dual redox cycles (Cu(2+) + Ce(3+) ↔ Cu(+) + Ce(4+), Cu(2+) + Ti(3+) ↔ Cu(+) + Ti(4+)) play key roles for the superior catalytic deNOx performance.