copper thin films with nano-scale structure have numerous applications in modern technology.  in this work, cu thin films with different thicknesses from 50–220 nm have been deposited on glass substrate by dc magnetron sputtering technique at room temperature in pure ar gas. the sputtering time was considered in 4, 8, 12 and 16 min, respectively. the thickness effect on the structural, morpholo...

Large-area and aligned copper oxide nanowires have been synthesized by thermal annealing of copper thin films deposited onto silicon substrate. The effects of the film deposition method, annealing temperature, film thickness, annealing gas, and patterning by photolithography are systematically investigated. Long and aligned nanowires can only be formed within a narrow temperature range from 400...

Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was appro...

this paper addresses the annealing temperature effect on nanostructure and phase transition of copper oxide thin films, deposited by pvd method on glass substrate (at 110 nm thickness) and post annealed at different temperatures (200-400°c) with a flow of 1 cm3s-1 oxygen. the x-ray diffraction (xrd) was employed for crystallographic and phase analyses, while atomic force microscopy (afm) was us...

A thin film process using ECR-ion beam sputtering with ultra pure (99.999999%) copper target was investigated for improving transportation properties in the film. The electric resistivity of the thin film was 40% lower than that of using a commercial-grade purity target. And the optical qualities evaluated by the transmission and reflection spectrum measurements were also indicate slower relaxa...

This paper reports the correlation between film thickness, nanostructure and DC electrical properties of copper thin films deposited by PVD method on glass substrate. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used for crystallography and morphology investigation, respectively. Resistivity was measured by four point probe instrument, while a Hall effects measurement system w...

The amount of twin formation of electroplated and thermally treated copper thin films was evaluated by electron back-scattering diffraction (EBSD) analysis. The result establishes the importance of twin formation in the analysis of stress-induced voiding, and indicates that with the inclusion of a copper alloy co-element, twin formation was significantly reduced relative to pure-copper. Further...

copper sulphide (cu 2 s) thin films at different thicknesses and annealing temperatures were deposited onto glass substrate by vacuum evaporation method. xrd study reveals the phase transformation of cu     2 s film at higher thickness. optical and resistivity study show the phase transformation of the film from cu     2 s to cus when they are annealed at higher temperature. sem st...

Effect of the change of crystallinity and micro texture of electroplated copper thin films by annealing on the stressinduced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of their electroplating conditions and the annealing temperature after the electroplating. The crystallinity of the electrop...