Co3W2Si intermetallic compound was synthesized by mechanical alloying (MA) of W, Co and Si elemental powder mixtures. The phase composition of the milled products was evaluated by X-ray diffraction (XRD) analysis. Morphological evolutions were characterized by transmission electron microscopy (TEM). The results showed that high energy ball milling performed in the present work led to the format...

in the present study, nanocrystalline ni50al50-xmox (x = 0, 0.5, 1, 2.5, 5) intermetallic compound was produced through mechanical alloying of nickel, aluminum, and molybdenum powders. alni compounds with good and attractive properties such as high melting point, high strength to weight ratio and high corrosion resistance especially at high temperatures have attracted the attention of many rese...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Sn–9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano particles (0.3, 0.5 and 1 wt%) with Sn–9Zn solder paste. In the monolithic Sn–Zn solder joints, scallop-shaped AuZn3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn3 intermetallic compound layer well adhered to ...

In the present study, nanocrystalline Ni50Al50-xMox (X = 0, 0.5, 1, 2.5, 5) intermetallic compound was produced through mechanical alloying of nickel, aluminum, and molybdenum powders. AlNi compounds with good and attractive properties such as high melting point, high strength to weight ratio and high corrosion resistance especially at high temperatures have attracted the attention of many rese...