Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 9 10 A/cm for 168.5 h at 150 C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a th...

In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The -Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with ...

A vertical continuous compound casting technology for the production of rotationally symmetric bilayer rods consisting brass CuZn37 and aluminum AA7075 was developed. The interface metallurgically bonded semi-finished products composed four intermetallic layers an anomalous eutectic area Al2Cu (?-AlCu), Al solid solution (?-Al), other precipitates. were CuZn (?-CuZn), a suggested two-phase regi...