نتایج جستجو برای: warpage

تعداد نتایج: 328  

Journal: :Journal of the Microelectronics and Packaging Society 2016

2002
Y. C. Lee B. McCarthy Jiankuai Diao Zhongxia Zhang K. F. Harsh

s With the advancements of MEMS foundry services and CAD tools, MEMS devices can be costeffectively designed and prototyped. Here, four designs that utilize these tools are presented: 1) a flexure design used to reduce the device warpage resulting from the mismatch in thermal expansion coefficients between the device and the substrate for flip-chip bonded MEMS, 2) a digitally positioned micro-m...

Journal: :Journal of the Korean Welding and Joining Society 2011

Journal: :Journal of Composite Materials 2021

Discontinuous Long Fibre (DLF) composites, composed of randomly-oriented strands chopped unidirectional pre-impregnated tape, have been used in the aerospace industry to produce intricate, net-shape parts with complex features – replacing complicated metallic brackets single, lightweight parts. Carbon/PEEK DLF composites suffer from warpage problems driven by several factors including their hig...

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