MEMS thermal actuators have been employed in a broad range of applications, often operating in different environments (e.g. vacuum, air or liquid). Since the involved heat dissipation mechanisms are different in different operating environments, the device performances are expected to be different. In this paper, we report experimental measurement and multiphysics modeling of device performance...

We present a systematic study on the effect of surface chemistry on thermal transport in colloidal nanocrystal (NC) solids. Using PbS NCs as a model system, we vary ligand binding group (thiol, amine, and atomic halides), ligand length (ethanedithiol, butanedithiol, hexanedithiol, and octanedithiol), and NC diameter (3.3-8.2 nm). Our experiments reveal several findings: (i) The ligand choice ca...

This paper proposes a new parameterized dynamic thermal modeling algorithm for emerging thermal-aware design and optimization for multi-core microprocessor design at architecture and package levels. Compared with existing behavioral thermal modeling algorithms, the proposed method can build the compact models from more general transient power and temperature waveforms used as training data. Suc...

Representative results of computer simulation and/or modeling studies of the nanomechanical and thermal transport properties of an individual carbon nanotube, silicon nanowire, and silicon carbide nanowire systems have been reviewed and compared with available experimental observations. The investigated nanomechanical properties include different elastic moduli of carbon nanotubes, silicon nano...

Technological improvements over the past decade have led to the widespread use of autonomous surface and underwater vehicles for data collection in marine environmental sensing and modeling in coastal environments. However, these vehicles and their sensors still have limitations, especially when tasked with observing highly dynamic or transient processes. We investigate the application of a sma...

& Experiments and finite difference thermal modeling of the induction-heated tool for end milling of elastomers are investigated. Three sets of experiments are designed to calibrate the contact thermocouple for the tool tip temperature measurement, study the effect of tool rotational speed on induction heat generation and convective heat transfer, and measure the tool temperature distribution f...

Hybrid structural electronics (HSE) consists of printed electronics, conventional rigid and load-bearing supporting parts a device (plastic, glass etc.). Extra-large area flexible lighting elements with embedded light-emitting diodes (LEDs) are an example such applications. LEDs can be used, for example, as light sources, to create smart surfaces the architectural or automotive industry. Once i...

Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible. Thermal codes have been unable to exploit the geometric information in structural models and the CAD design database, and do ...

A new one-dimensional thermal network modeling approach is proposed that can accurately predict transient/dynamic temperature distribution of passive cooling systems. The present model has applications in variety of electronic, power electronic, photonics, and telecom systems, especially where the system load fluctuates over time. The main components of a cooling system including: heat spreader...