Dense Silicon nitride was investigated to determine the effect of its microstructural parameters and densification on thermo-mechanical properties and thermal stress resistance to fracture initiation during a hot or cold mechanical and thermal shock testing. The different materials and microstructures were obtained by changing the parameters such as the type of the powder, additive, forming p...

For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic Sn...

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternating current. Such conditions preclude electromigration, but cause cyclic strains due to mismatch in coefficients of thermal expansion between film an...