The use of the temperature criterion in design metal-cutting machines, determined on basis models that take into account contact thermal resistances, is an objective necessity. These should to maximum extent actual conditions parts under consideration, by deviations mating surfaces from ideal shape. article presents results numerical modeling based finite element method formation resistance and...

Low contact resistance between graphene and metals is of paramount importance to fabricate high performance graphene-based devices. In this paper, the impact of both defects induced by helium ion (He⁺) bombardment and annealing on the contact resistance between graphene and various metals (Ag, Pd, and Pt) were systematically explored. It is found that the contact resistances between all metals ...

We investigate thermal noise mechanisms and present analytical expressions of the noise power spectral density at high frequencies (HF) in Silicon-on-insulator (SOI) MOSFETs. The developed HF noise model of RF T-gate body contact (TB) SOI MOSFET for 0.13-μm SOI CMOS technology accounts for the mechanisms of 1) channel thermal noise; 2) induced gate noise; 3) substrate resistance noise and 4) ga...

With the on-going increase in the power density of electronic devices, thermal management remains a central issue for upholding device performance and reliability. Thermal interface materials (TIMs), used to conduct heat across the multiple interfaces between the device and heat sink, with unprecedentedly low thermal resistance and a high degree of mechanical compliance to accommodate mismatche...

The concepts of temperature and entropy as applied in equilibrium thermodynamics do not easily generalize to nonequilibrium systems and there are transient systems where thermodynamics cannot apply. However, it is possible that nonequilibrium steady states may have a thermodynamics description. We explore the consequences of a particular microscopic thermostat-reservoir contact needed to both s...

This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrate...

Vertical carbon nanotube (CNT) forests bonded at room temperature with sprayed on nanoscale polymer coatings are found by measurement to produce thermal resistances that are on a par with those of conventional metallic solders. These results are achieved by reducing the high contact resistance at CNT tips, which has hindered the development of high performance thermal interface materials based ...