Numerical methods like the finite element (FE) method are often used to evaluate the reliability of electronic packages. However, the accuracy of non-linear numerical analyses should be confirmed by experimental measurements. In this study, we evaluated the strain distribution in flip chip (FC) packages with multi-layered printed circuit boards (PCBs) by combining the digital image correlation ...

The Printed Circuit Board (PCB) assembly domain has almost completed its transition to a lead-free environment. This shift has resulted in the obsolescence of tin-lead components. However, occasionally, on-going production or repair processes require SnPb components which are no longer available. Using a lead-free device in such cases could result in reliability concerns (due to the use of lead...

Keywords: Power electronics High temperature Shear Creep Nano-indentation Hardening a b s t r a c t An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly ...

This study presents an electrical current testing that is based on the Sn­xAg­0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn­3Ag­0.5Cu (SAC305) alloy presented a continuou...

It is crucial to understand the creep behavior of Pb-free solder alloys in electronic packaging. Typical service environments are between 298 and 373K. The thermal mismatch induced stresses acting on solder joints result in extensive rate-dependent plastic deformation. The solder alloy is potentially the weakest component in the electronic package because normal operating temperatures are alrea...

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints. Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the dur...

In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analy...

This paper will share current results of Amkor’s WLCSP board level reliability testing for both larger package size and smaller pitch. The 6.8mm test vehicle used for the large WLCSP package testing has 196 I/O set on a 400um pitch uniform array. The 300um pitch package has 100 I/O and is 3.8mm on each side. Amongst other design variations, solder alloy and redistribution layer thickness are ex...