Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile elect...

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed ampl...

Voids in solder joints have been considered as a defect in electronics assembly. The factors that affect void formation are complex and involve the interaction of many factors. There are no established standards for void size and void area in a solder joint for it to be deemed defective. Inspection criteria have been very subjective. The effect of voids on the reliability of solder joint may de...

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...

The main aim of this work was to determine the soldering, thermal and mechanical properties of joints fabricated by use of Au-20Sn solder. Soldered joints were fabricated by application of a flux-free process with assistance of power ultrasound. By acting of power ultrasound, the Au-20Sn solder wets the surface of Cu, Ag and Ni substrates. The contact wetting angle on all substrates varied with...

Understanding the mechanical degradation of microelectronic solder joints under high electric current stressing is an important step to develop a damage mechanics model in order to predict the reliability of a solder joint under such loading. In this paper, the experiment results for flip chip solder joints under high current stressing are reported. Nanoindentation tests suggest that mechanical...

b fast and highly reliable method of inspecting minule solder joints of high-density rnouaed devices hns been dcveloperl. It uses two techniques to detect all types of defects, such as unsoldered leads. solder bridges. and mis-aligned leads. One applieszxternal Form to solder joints with an air jet. which vibrates w shifts unsoldered leads. The vibration and shift is detected as a change in the...

In this article, the failure behaviors of different solder balls and arrays used in a commercial produce were investigated experimentally and computationally. The results indicated that the effect of different solder balls and arrays on the failure behavior of Package-on-Package (PoP) structure cannot be ignored. For example, the failure mechanism of a structure with 2 15 solder balls could be ...

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermet...

This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn– 3.0Ag and Sn–1.0In with that of a baseline Sn–3.0Ag–0.5Cu solder joint under a severe temper...