Integrated optoelectronic interconnect offers a potentially lower cost, higher density alternative to wire-based technologies for I/O. For most applications, low cost IC packages provide an effective means of I/O in a system. However, some applications, such as image processing, require higher levels of off-chip I/O bandwidth than can be provided using perimeter bonded ICs. The SIMD Pixel Proce...

A new smart-sensor VLSI circuit intended for focal-plane processing of grey-scale images is presented. The architecture is based on a fine-grain software-programmable SIMD array. Processing elements, integrated within each pixel of the imager, are implemented utilising a switched-current analogue microprocessor concept. In a 0.6μm CMOS process the cell size is equal to 98.6μm×98.6μm. A prototyp...

We describe a new method for accurately measuring the relationship between pixel coordinates of neighboring projectors in a tiled projection display. The method can be used to calibrate the alignment and distortions in the tiled display and to touch up existing calibrations with local corrections. Additionally, by simultaneously measuring the characteristic spacing of textural features on the s...

A nonobtrusive technique for measuring misalignment errors in multistage free-space optical interconnects is proposed. The technique makes use of dedicated microoptics to relay higher order dedicated alignment beams generated by an optical power supply onto alignment detectors located on the periphery of a smart pixel chip. An implementation of this technique for measuring lateral (x–y) misalig...

A hybrid micro-macro-optical shuffle interconnection approach is described. The new concept minimizes distortion in multichip smart-pixel shuffle interconnection systems that use macro-optics to link dense arrays of vertical-cavity surface-emitting laser (VCSEL) sources and matching arrays of detectors. The typical narrow-beam cones of VCSEL's are exploited by use of beam-deflecting micro-optic...

A new CMOS-based image sensor that is intrinsically compatible with onchip CMOS circuitry is reported. The new CMOS active pixel image sensor achieves low noise, high sensitivity, X-Y addressability, and has simple timing requirements. The image sensor was fabricated using a 2 pm p-well CMOS process, and consists of a 128 x 128 array of 40 pm x 40 pm pixels. The CMOS image sensor technology ena...

Real-time and accurate background modeling is an important researching topic in the fields of remote monitoring and video surveillance. Meanwhile, effective foreground detection is a preliminary requirement and decision-making basis for sustainable energy management, especially in smart meters. The environment monitoring results provide a decision-making basis for energy-saving strategies. For ...