نتایج جستجو برای: ls dyna

تعداد نتایج: 11361  

Journal: :E3S web of conferences 2021

The bow flare slamming load was studied by using the software Ls-dyna. A coupling finite element model including air, water and 3d established. Flare pressure picked up from in order to discuss relation between velocity as well distribution rule of different entry angle along length height ship.

2003
Peter Gantner David K. Harrison Anjali K. M. De Silva Herbert Bauer

This paper is concerned with closing a gap in the process chain of metal forming. Tools for simulating the metal forming process like LS-DYNA® produce output geometries and stress information which cannot be easily re-imported in CADSystems or structure analysis programs for further processing. A concept has been developed and implemented with a corresponding program which allows the re-importa...

2016
Ju Tao Xiaochuan Tan Xiaoguang Su

In order to identify the engine inlet oil film parameters more accurately, the oil film identification equation based on oil film model is built under the consideration of random error which is consisted by model error and measurement error. For the purpose of eliminating the influence of random error to the identification results, Recursive Auxiliary Variable (RAV) is put forward. At the same ...

2006
Baris Bayram Goksen G. Yaralioglu Mario Kupnik Butrus T. Khuri-Yakub

This paper reports on the finite element analysis (FEA) of crosstalk in capacitive micromachined ultrasonic transducer (CMUT) arrays. Finite element calculations using a commercial package (LS-DYNA) were performed for an immersed 1-D CMUT array operating in the conventional and collapsed modes. LS-DYNA was used to model the crosstalk in CMUT arrays under specific voltage bias and excitation con...

2008
J. Zouhar

This paper deals with modelling of the orthogonal machining process using tools with different geometries. The finite element method (FEM) is used for a simulation based on the Lagrangian formulation including ANSYS/LS-DYNA software. The constitutive Johnson – Cook material model regarding strain, strain rate and temperature to predict material plasticity and chip separation is used. Chip morph...

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