Diode pumped solid state (DPSS) Q-switched nanosecond pulsed lasers are becoming the laser of choice for a wide variety of processes in printed circuit board (PCB) manufacturing. Lasers are being used today in PCB manufacturing for via drilling, depaneling, profiling (cutting), laser direct imaging (LDI), repair, trimming, marking, skiving and other processes. The majority of these processes ar...

High power carbon dioxide lasers have successfully been used in drilling or cutting ngineering materials such as metals, polymers and ceramics over the years. Can a arbon dioxide laser be used to efficiently drill different rocks in a deep gas well? esearch sponsored by US Department of Energy has been carried out to answer this uestion. This paper will report the study results of using a super...

The Drill for the Mars Science Laboratory mission is a rotary-percussive sample acquisition device with an emphasis on toughness and robustness to handle the harsh environment on Mars. The unique challenges associated with autonomous drilling from a mobile robot are addressed. A highly compressed development schedule dictated a modular design architecture that satisfies the functional and load ...

Cemented carbide parts have been manufactured from WC-12Co granules by “Solvent on Granules 3D-Printing” and compared with reference produced conventional press sintering. SG-3DP consists in growing a green part layer-by-layer selective solvent jetting powder-polymer granule beds. Both 3D printed uniaxially pressed compacts consolidated thermal debinding liquid phase Further densification has a...

To study the influence of the main parameters on the process of laser drilling in various samples from aluminium, copper and silver, numerical experiments are carried out with specialized software TEMPERATURFEL3D, working in MATLAB. The results refer to the fiber laser and CuBr laser modern laser, whose applications in various technological processes are still being explored. The dependences of...

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target are...

Laser-incision is gaining recognition in the timber processing industry as a preferred and competitive technique for increasing uptake of chemical preservative treatments. This work details percussion Nd:YAG laser-incision Radiata Pine, conducted at different wavelengths, incident laser energies focal point positions. For first time, effect wood anatomy (latewood earlywood tissues) on efficienc...