Thermally robust monolayers of 4-6 nm diameter FePt nanoparticles (NPs) were fabricated by combining chemical synthesis and atomic layer deposition. Spin-cast monolayers of FePt NPs were coated with thin, 11 nm-thick layers of amorphous Al(2)O(3), followed by annealing to convert the FePt NPs from an alloy (A1) into intermetallic FePt (L1(0)) and FePt(3) (L1(2)) phases. The Al(2)O(3) layer serv...

After preliminary investigations o f the B a -N a N system, resulting in the discovery of the first sub-nitride NaBa3N [1], we decided to examine more closely the intermetallic phases formed by the two metals, leading to the discovery of the new Laves phase N a2Ba. The literature contains a variety o f conflicting reports concerning N a -B a intermetallic phases. The standard references for bin...

In the presented article, the temperature effect was studied on creep properties and fracture behaviors of AlSi12Cu3Ni2MgFe aluminum-silicon alloys, unreinforced and reinforced with SiO2 nano-particles. For such objective, standard specimens were fabricated by gravity casting and stir-casting methods, for aluminum alloys and nano-composites, respectively. Then, force-controlled creep...

in this research, tribological behavior of ti-ni-p intermetallic coatings on titanium substrates have been investigated under dry reciprocating conditions. hardness profile testing results exhibit that high surface hardness has been attained and static indentation result shows that the intermetallic coating has better adhesion strength than the conventional ceramic coatings. in this respect, th...

Intermetallic compounds having compositions from HfCo4 to HfCo8 were investigated by transmission electron microscopy, selected-area electron diffraction, and energy-dispersive x-ray spectroscopy. A major crystalline phase, closely related to the orthorhombic Zr2Co11 phase in structure, has been observed in the samples with the composition ranges from HfCo6 to HfCo8. The phase, referred to as e...

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

The paper focuses on the strength and toughness of joints produced by transient liquid phase (TLP) bonding in the Cu–Sn system. It is motivated by potential applications of TLP bonding in attachment of high-temperature wide bandgap devices to ceramic substrates. Model test specimens suitable for mechanical testing are developed, utilizing substrates of oxide dispersion strengthened copper. Thre...

Using the evolutionary optimization algorithm, as implemented in the USPEX crystal predictor program, and first principles total energy calculations, the compositional phase diagrams for Al-Sc and Al-Ta alloy systems at zero temperature and pressure have been calculated. In addition to the known binary intermetallic phases, new potentially stable alloys, AlSc3 and AlTa7, have been identified in...