In this research, tribological behavior of Ti-Ni-P intermetallic coatings on titanium substrates have been investigated under dry reciprocating conditions. Hardness profile testing results exhibit that high surface hardness has been attained and static indentation result shows that the intermetallic coating has better adhesion strength than the conventional ceramic coatings. In this respect, th...

In situ X-ray photoelectron spectroscopy and low-energy ion scattering were used to study the preparation, (thermo)chemical and catalytic properties of 1:1 PdGa intermetallic near-surface phases. Deposition of several multilayers of Ga metal and subsequent annealing to 503-523 K led to the formation of a multi-layered 1:1 PdGa near-surface state without desorption of excess Ga to the gas phase....

Intermetallic compounds are garnering increasing attention as efficient catalysts for improved selectivity in chemical processes. Here, using a ship-in-a-bottle strategy, we synthesize single-phase platinum-based intermetallic nanoparticles (NPs) protected by a mesoporous silica (mSiO2) shell by heterogeneous reduction and nucleation of Sn, Pb, or Zn in mSiO2-encapsulated Pt NPs. For selective ...

The crystallization kinetics of an Al89La6Ni5 amorphous alloy were studied by thermal analysis. Both continuous heating and isothermal DSC traces showed that the Al89La6Ni5 amorphous alloy undergoes a two-stage crystallization process upon heating. The ®rst transformation, in which fcc-Al precipitates from the amorphous matrix, is a nucleation and three-dimensional di€usion-controlled growth pr...

This study presents an electrical current testing that is based on the Sn­xAg­0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn­3Ag­0.5Cu (SAC305) alloy presented a continuou...

As the trend in requirements of electronic packaging is toward higher I/O, greater performance, higher density, and lighter weight, the use of area array packaging technology is expected to increase. The type of packaging, such as ball grid array (BGA), chip scale package (CSP), and Flip Chip, provides the ultimate in high I/O-density and count with superior electrical performance, and very sma...

The need of a concerted multi-disciplinary approach in the investigation of intermetallic systems and the role of thermochemistry are underlined. The activity carried out in the Author’s laboratory in the alloy thermodynamics is summarized. The different instruments (calorimeters) built in laboratory are briefly presented and their performance discussed. The results obtained in the measurement ...

• Solidification of Al-5wt%Fe alloys was monitored via high-speed synchrotron tomography. Formation dynamics Al 13 Fe 4 intermetallics were revealed. Hole-like defects filled with aluminium melt observed within the intermetallics. Oriented particle attachment as a potential growth hypothesis proposed. High-speed tomography used to investigate nucleation and intermetallic during solidification a...

This investigation was conducted to ascertain the benefits of electropolishing after mechanical polishing for electron backscattered diffraction of a Ti 2 AlNb intermetallic Ti − 21Al − 29Nb (at.%) alloy containing the orthorhombic (O) and body-centered-cubic (BCC) phases. Electropolishing was performed at − 40 ° C in 6% H 2 SO 4 methanol solution. Atomic force microscopy was used to measure th...