Thermal management is the current bottleneck in advancement of high-power integrated circuits (ICs), and phase change heat sinks are a promising solution. With unique structural configuration consisting membrane positioned above heater surface, membrane-based (MHSs) have thus far attained fluxes up to 2 kW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/199...

Description Background – In recent times there is a notable increase in research towards compact, high heat flux, dedicated cooling solutions for electronic systems. This is due to an ever increasing power density of these electronic components that needs to be dissipated. Conventional cooling using finned heat sinks with air is inadequate to keep up with these increasingly stringent cooling de...

Abstract—In this numerical study, we want to present the design of highly efficient extruded-type heat sink. The symmetrically arranged extruded-type heat sinks are used instead of a single extruded or swaged-type heat sink. In this parametric study, the maximum temperatures, the base temperatures between heaters, and the heat release rates were investigated with respect to the arrangements of ...

[1] One difficulty for ocean modeling is the lack of velocity data for specifying the initial condition. Diagnostic initialization is widely used; it integrates the model from known temperature (Tc) and salinity (Sc) and zero velocity fields while holding (Tc, Sc) unchanged. After a period (around 30 days) of the diagnostic run, the velocity field (Vc) is established, and (Tc, Sc, Vc) fields ar...

We report on a novel method for local control of shell engineering in multiwalled carbon nanotubes (MWNTs) using Joule-heating induced electric breakdown. By modulating the heat dissipation along a nanotube, we can confine its thinning and shell breakdown to occur within localized regions of peak temperatures, which are distributed over one-half of the NT length. The modulation is achieved by u...

It is envisioned that conventional air cooling techniques using heat sinks are not able to sufficiently cool future generations of high heat dissipation semiconductor processors. Thus, alternative cooling approaches are being extensively studied as substitutes. This paper presents a literature review of the available refrigeration systems and system simulation models for electronics cooling. Th...

The power dissipation levels in high performance personal computers continue to increase rapidly while the silicon die temperature requirements remain unchanged or have been lowered. Advanced air cooling solutions for the major heat sources such as CPU and GPU modules use heat pipes and high flow rate fans to manage the heat load at the expense of significant increases in the sound power emitte...