Self-healing represents a new paradigm for active and responsive materials. As first demonstrated by White et al., and subsequently in additional publications, polymer composites can be engineered to chemically self-heal. However, the chemistry of previous systems possesses inherent shortcomings due to the potential side reactions with the polymer matrix and air. Here we present a new, chemical...

A novel method for preparing epoxy/silver nanocomposites was developed via the in situ formation of silver nanoparticles (AgNPs) within the epoxy resin matrix while using silver nanowires (AgNWs) as a conductive filler. The silver–imidazole complex was synthesized from silver acetate (AgAc) and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole (imidazole). AgNPs were generated in situ during the curin...

in the present study, the effect of various weight fractions of graphene nanoplatelet (gpl) on flexural fatigue behavior of epoxy polymer has been investigated at room temperature and generally the temperature was monitored on the surface of specimen during each test. the flexural stiffness of grapheme nano-platelet/epoxy nanocomposites at 0.1, 0.25 and 0.5 wt. % as a main effective parameter o...

AlN/epoxy composites with high thermal conductivity were successfully prepared by infiltrating epoxy into AlN porous ceramics which were fabricated by gelcasting of foaming method. The microstructure, mechanical, and thermal properties of the resulting composites were investigated. The compressive strengths of the AlN/epoxy composites were enhanced compared with the pure epoxy. The AlN/epoxy co...

In this paper an attempt has beenmade to optimize ply stacking sequence of single piece E-Glass/Epoxy, HM Carbon/Epoxy and Boron/Epoxy composite drive shafts using particle swarm optimization (PSOA). PSOA programme is developed using MATLAB V 7 to optimize the ply stacking sequence with an objective of weight minimization. The weight savings of the E-Glass/Epoxy, HMCarbon/Epoxy andBoron/Epoxy s...

Polysulfide resins,with trade name of  G4 and G112, with short and long chain lengths respectively, were used as reactive modifiers to toughen epoxy resin. The effects of molecular weights of G4 and G112 on impact resistance, dielectric constant, thermal conductivity as well as decomposition  heat and adhesion properties of toughened epoxy were investigated. The impact strength and the diel...

Effects of chemical structure changes on the thermal, mechanical, and crystalline properties of rigid rod epoxy resins have been studied for azomethine epoxy, biphenol epoxy, and tetramethyl biphenol epoxy. Rigid rod epoxies have exhibited better properties than those of the flexible bisphenol A epoxy. The chemical structures of both rigid rod epoxy and curing agent control the properties of cu...

STATEMENT OF PROBLEM Resinous die materials have several important advantages including strength, abrasion resistance, and detail reproduction. Despite these advantages, the shrinkage of resinous die materials during polymerization has limited their widespread acceptance. PURPOSE This study determined whether a retarded setting reaction could improve the accuracy of an epoxy resin die system,...