This work identifies microstructural conversion mechanisms during hot deformation (at temperatures ranging from 750 °C to 1050 °C and strain rates ranging from 10-3 s-1 to 1 s-1) of a Ti-5Al-2Sn-2Zr-4Mo-4Cr (Ti-17) alloy with a lamellar starting microstructure and establishes constitutive formulae for predicting the microstructural evolution using finite-element analysis. In the α phase, lamell...

Dynamic recrystallization (DRX) is almost universally observed in the microstructure of adiabatic shear bands. It is usually admitted that DRX results from the large temperatures that develop in the band along with very high local strains. This paper reports the observation of dynamically recrystallized nanograins in Ti6Al4V alloy specimens that were impact loaded to only half the failure strai...

We present high resolution observations of microstructure and texture evolution during dynamic recrystallization (DRX) of ice polycrystals deformed in the laboratory at high temperature (≈0.98Tm). Ice possesses a significant viscoplastic anisotropy that induces strong strain heterogeneities, which result in an early occurrence of DRX mechanisms. It is therefore a model material to explore these...

Solder alloys are widely used bonding materials in electronics industry. The reliability con‐ cerns for solder interconnections, which provide both mechanical and electronic connec‐ tions, are rising with the increasing use of highly integrated components in portable electronic products [1-6]. As shown in Fig. 1, a typical ball grid array (BGA) component board usually consists of a silicone die...