The resistive switching characteristics of the Cu/SiO x /Pt structure (control sample) exhibited a direct correlation to humidity. The H2O vapor formed the Cu oxide at the Cu/SiO x interface, and Cu ions were injected from the Cu oxide into the SiO x layer, thus improving the resistive switching. However, the control sample demonstrated substantial switching dispersion in a vaporless environmen...

Infants are exposed to variable copper (Cu) intake; Cu in breast milk is low, whereas infant formulas vary in Cu content as well as the water used for their preparation. Little is known about the regulation of Cu absorption during infancy. The objectives of this study were to determine effects of Cu supplementation on Cu absorption and tissue distribution and the expression of Cu transporters i...

The objective of this study was to investigate the effect of supplemental tribasic copper chloride (TBCC) vs Cu sulfate on the Cu status and voluntary forage intake of growing heifers fed forage-based diets. Twenty-four crossbred heifers were stratified by weight and randomly allotted to individual pens. Heifers were provided free-choice access to ground grass hay (8.0 and 54.0% CP and TDN, res...

In most cases authors are permitted to post their version of the article (e.g. in Word or Tex form) to their personal website or institutional repository. Authors requiring further information regarding Elsevier's archiving and manuscript policies are encouraged to visit: a b s t r a c t The reactions between Sn2.5Ag solder doped with different levels of Ni (0–0.1 wt.%) and two different types ...

Copper (Cu) is an essential metal that is toxic at high concentrations. Thus, pathogens often rely on host Cu for growth, but host cells can hyperaccumulate Cu to exert antimicrobial effects. The human fungal pathogen Cryptococcus neoformans encodes many Cu-responsive genes, but their role in infection is unclear. We determined that pulmonary C. neoformans infection results in Cu-specific induc...

Cu(0) nanoparticles were deposited on a nanoporous polymer to develop a novel nanocatalyst (Cu-B) for carrying out Ullmann coupling of aryl halides with amines in water. Non-aqueous polymerization of a mixture of divinylbenzene and acrylic acid under hydrothermal conditions followed by the deposition of Cu(0) nanoparticles were adopted to afford the Cu-B nanocatalyst. In order to compare the ca...

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

Copper (Cu) could be suitable to create anti-infective implants based on Titanium (Ti), for example by incorporating Cu into the implant surface using plasma immersion ion implantation (Cu-PIII). The cytotoxicity of Cu might be circumvented by an additional cell-adhesive plasma polymerized allylamine film (PPAAm). Thus, this study aimed to examine in vivo local inflammatory reactions for Ti6Al4...

The interaction of ultrathin fdms of Cu with Rh(100) and Ru(0001) has been examined by using X-ray photoelectron spectrapcopy (XPS). The effects of surface annealing temperature, adsorbate coverage (film thickness), and CO chemisorption were investigated. The XPS data show that the atoms in a monolayer of Cu supported on Rh( 100) or Ru(0001) are electronically perturbed with respect to the surf...

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10μm and 15μm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a m...