The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of technological options and challenges. The possibilities presented herein indicate a fourto ten-fold increase in heat flux over the air-cooled systems. T...

Cooling intense high-energy hadron beams remains a major challenge in modern accelerator physics. Synchrotron radiation of such beams is too feeble to provide significant cooling: even in the Large Hadron Collider (LHC) with 7 TeV protons, the longitudinal damping time is about thirteen hours. Decrements of traditional electron cooling decrease rapidly as the high power of beam energy, and an e...

The ice crystal formation is assumed as the most lethal factor for the failure of fish embryo cryopreservation and intracellular ice formation (IIF) plays a central role in cell injury during cooling. The objectives were to observe the morphological changes of red seabream (Pagrus major) embryo during the cooling-thawing process, and to examine the effect of cryoprotectant and cooling rate on t...

Elastic and spin-changing inelastic collision cross sections between oxygen molecules and helium atoms are computed in the energy range 0.1–10 K. This study explores the recently demonstrated buffer-gas cooling process that produces magnetically trapped, translationally cold molecules. Conclusions are drawn about the favorable prospects of cooling oxygen molecules, and about the general feasibi...

The hybrid indirect evaporative cooling-mechanical vapor compression (IEC-MVC) process is an emerging cooling technology that combines the advantages of IEC and MVC, i.e., effective temperature humidity control, high energy efficiency, low water consumption. This paper presents experimental study IEC-MVC process. A 1-Rton pilot fabricated by connecting MVC in series, its performance evaluated u...