In this paper, we study wire width planning for interconnect performance optimization in an interconnect-centric design flow. We first propose some simplified, yet near-optimal wire sizing schemes, using only one or two discrete wire widths. Our sensitivity study on wire sizing optimization further suggests that there exists a small set of “globally” optimal wire widths for a range of interconn...

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to ...

In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, al...

\Permission to make digital/hard copy of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for proot or commercial advantage , the copyright notice, the title of the publication and its date appear, and notice is given that copying is by permission of CBL. To copy otherwise, to republish, to post on servers or to redis...

In this paper, we present a completely new approach to the problem of delay minimization by simultaneous buffer insertion and wire sizing for a wire. We show that the problem can be formulated as a convex quadratic program, which is known to be solvable in polynomial time. Nevertheless, we explore some special properties of our problem and derive an optimal and very efficient algorithm modified...

During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold applications. The most commonly used c...

An interaction of a negatively biased wire with a monolayer lattice of negatively charged particles has been studied experimentally. The particles levitated at the height of the wire in a sheath of an rf discharge. It was found that the particles close to the wire were repelled from it electrostatically, while the far particles were attracted due to the drag of the ion flow deflected toward the...