Wafer bonding has been widely used for forming vacuum and hermetic packages for MEMS devices. Several techniques, including anodic silicon-glass, silicon-silicon fusion, metal compression, glass frit, eutectic, and solder bonding have been attempted and some have been demonstrated successfully. Solders have some advantages that make them an interesting area of research for wafer bonding. They o...

on the shear bond strength (SBS) of metallic orthodontic brackets bonded to feldspathic ceramic by a composite resin. Twenty-five ceramic cylinders were etched with 10% hydrofluoric acid for 60 s and received two layers of silane. Brackets were bonded to the cylinders using Transbond XT and assigned to 5 groups (n=5): Group 1 – Control group (without thermal cycling); Group 2 – 500 thermal cycl...

This paper investigates the effect of metallic sheaths on losses and temperature of medium voltage power cables. Two grounding methods of sheaths, including both ends bonding and single point bonding that causes different situations on cable ampacity, are considered. Electrical losses of cables that are main sources of heat are calculated in both conductor and metallic sheath of the cables. She...

Aerated concrete blocks (AC) are widely used as masonry in building construction because of their light weight and low density. Try to determine the strength, bonding, cracking thermal behavior aerated at different temperatures, mortar ratios thickness. The results show that temperatures above 100°C, strength will decrease cracks appear, bonding vary with thickness proportion mortar. Compared s...

We preform a quantitative investigation of the energetics of thermally induced sp3 → sp2 conversion of carboncarbon bonds in tetrahedral amorphous carbon (ta-C) films by using near edge x-ray absorption fine structure (NEXAFS) and Raman spectroscopy. We investigate the evolution of the bonding configuration in ta-C thin films subjected to high temperature annealing in flowing Argon gas using a ...

We propose that stress can decrease the internal friction of amorphous solids, either by increasing the potential barriers of defects, thus reducing their tunneling and thermal activation that produce loss, or by decreasing the coupling between defects and phonons. This stress can be from impurities, atomic bonding constraints, or externally applied stress. Externally applied stress also reduce...

Partially phosphorylated polyvinyl alcohol (PPVA) with aluminum phosphate (ALPO4) composites was synthesized by solution casting technique to produce (PPVA)(100-y) - (ALPO4)(y) (y = 0, 1, and 2). The surface structure and thermal properties of the films were characterized using Fourier transform infrared (FTIR) spectroscopy and thermogravimetric analysis (TGA). The results showed that the films...

The role of dynamic processes on self-assembled structures of 4'-([2,2':6', 2''-terpyridin]-4'-yl)-[1,1'-biphenyl]-4-carboxylic acid (l) molecules on Au(III) has been studied by scanning tunneling microscopy. The as-deposited monolayer is closed-packed and periodic in a short-range due to dipole forces. A thermal annealing process at 110 degrees drives such disordered monolayer into ordered cha...

The Low Temperature Transient Liquid Phase Diffusion Bonding (L TTLP) process has been used to reduce the residual stresses and hence, improve the thermal fatigue performance of bonds between dissimilar electronic packaging materials. Aluminum oxide plated with either gold or copper has been bonded to copper heatsinks at temperatures less than 160°C using In-Sn eutectic solders. After two hour...