نتایج جستجو برای: springs

تعداد نتایج: 8321  

Journal: :J. Electronic Imaging 2000
Clayton Brian Atkins Jan P. Allebach Charles A. Bouman

Many binary halftoning algorithms tend to render extreme tones (i.e., very light or very dark tones) with objectionable dot distributions. To alleviate this artifact, we introduce a halftone postprocessing algorithm called the Springs algorithm. The objective of Springs is to rearrange minority pixels in affected regions for a smoother, more attractive rendition. In this paper, we describe the ...

2010
Juan D. Serna Amitabh Joshi

Springs are used for a wide range of applications in physics and engineering. Possibly, one of its most common uses is to study the nature of restoring forces in oscillatory systems. While experiments that verify the Hooke’s law using springs are abundant in the physics literature, those that explore the combination of several springs together are very rare. In this paper, an experiment designe...

2004
Michael Manga James W. Kirchner

[1] Circulating groundwater transports heat. If groundwater flow velocities are sufficiently high, most of the subsurface heat transport can occur by advection. This is the case, for example, in the Cascades volcanic arc where much of the background geothermal heat is transported advectively and then discharged when the groundwater emerges at springs. The temperature of spring water can thus be...

Journal: :Current Biology 2018

Journal: :Journal of Vascular Surgery 2018

Journal: :The Boston Medical and Surgical Journal 1844

Journal: :The Annals of Iowa 1955

2013
Joshua K. Miller Anupma Prakash Ronald Daanen Michael Whalen Dick Benoit William Cumming Arthur C. Clark Markus Mager Gwen Holdmann

Pilgrim Hot Springs has a known shallow geothermal reservoir with temperatures approaching 91 ̊C in the top 100 meters of the system that underlies the main hot springs area of 1.5 km. The deeper reservoir is less understood with similar temperatures at the basement surface 320 meters directly beneath the hot springs. The aspect of this research is to create a stratigraphic model and delineate p...

1999
Donald L. Smith David K. Fork Robert L. Thornton Andrew S. Alimonda Christopher L. Chua

Bonding-pad densities on high-performance integratedcircuit chips are beginning to exceed the limits of available interconnect technologies. Also, stresses due to thermal mismatch in flip-chipped packages are reducing time to contact failure. We have addressed both of these problems by microlithographically fabricating highly elastic cantilever springs in linear arrays on pitches down to 6 μm. ...

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