0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.04.018 ⇑ Corresponding author. E-mail address: [email protected] (Y.-L. Shen). The misalignment effect in three dimensional (3D) chip packages is studied numerically using the finite element method (FEM). The model features a through-silicon-via (TSV)/micro-bump bonding structure connecting two adjacent sil...

When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder interconnections become multicomponent alloy systems whose microstructures cannot be predicted on the basis of the SnPb metallurgy. To better understand the influences of these microstructures on the reliability of lead-free electronics assemblies, SnAgCu-bumped components were...

Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. This is being taken as an action to reduce environmental impact when such products are discarded. Despite the fact that lead containing solders in electronic assemblies account for only 0.49% of world lead consumption, the trend in legislation will likely be to require not only reduced lead...

Since July, 2006, following the EU’s RoHS legislation, the consumer electronics industry has been offering “green” products by eliminating Pb-containing solders and other toxic materials. This transition has been relatively smooth, because the reliability requirements are less stringent. However, the Pb-free transition for high performance electronic systems (such as servers and telecommunicati...

Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure modes as creep and fatigue. The above paper focuses on the experimental measurements and corresponding analysis with the microindentation tests of the SAC 405 solder alloy due...

Ni-based under-bump metallization (UBM) has attracted wide attention due to its low reaction rate with Sn, compared with Cu and Cu alloy. In this study, the interfacial reactions between eutectic Sn–3.5Ag solder and Ni-based UBM, including electroplated Ni (EP-Ni) and electroless Ni (EL-Ni) are investigated. Morphology and growth kinetics of Ni3Sn4 intermetallic compounds are studied at differe...

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint re...

Hot solder dipping is an accepted method to mitigate whisker growth on electronic components plated with pure tin. To provide the best protection from tin whiskers, the solder coating needs to be up to the package body. The conventional wisdom for solder dipping maintains that dipping up to the package body can cause component damage. If the specific construction differences of ceramic and plas...