akbar pirestani,*, mohammad javad bagheri, sayed mahdi hashemi, amir hossine asgarishahi   department of animal science, khorasgan (isfahan) branch, islamic azad university, isfahan, iran     *corresponding author: email: [email protected]     received: 20 july 2013   accepted: 21 november 2013       abstract this study was conducted to evaluate the impact of se+vit e and cu injection on...

the massive sulphide deposit at kantienpan cu-zn mine is hosted by volcano sedimentary succession known as the areachap group, in the eastern part of namaqua metamorphic province, south africa. the deposits were affected by a complex deformation and metamorphic history and represent examples of upper amphibolite to granulite grade metamorphosed volcanic-hosted massive sulphide (vhms) depo...

CoFe/Cu multilayer nanowires were electrodeposited into anodic aluminum oxide templates prepared by a two-step mild anodization method, using the single-bath technique. Nanowires with 30 nm diameter and the definite lengths were obtained. The effect of CoFe layers thickness and annealing on the magnetic behavior of the multilayer nanowires was investigated. The layers thickness was controlled t...

TheMarcona–Mina Justa deposit cluster, hosted by Lower Paleozoic metaclastic rocks and Middle Jurassic shallow marine andesites, incorporates the most important known magnetite mineralization in the Andes at Marcona (1.9 Gt at 55.4% Fe and 0.12% Cu) and one of the few major iron oxide–copper–gold (IOCG) deposits with economic Cu grades (346.6 Mt at 0.71% Cu, 3.8 g/t Ag and 0.03 g/t Au) at Mina ...

Pulsed laser deposition (PLD) has been proposed several years ago as a suitable technique to deposit a pure Mg film over a radio frequency (rf ) gun Cu backflange in order to obtain a high efficiency photocathode surface for the generation of high brightness electron beams. In this paper we report preliminary experimental results on the emission properties of a PLD grown Mg film within the high...

Cu doped chalcogenide ChG glassy films in the As–Se–Te glass system have been prepared using thermal evaporation techniques. Single-source evaporation from bulk 1−x As0.40Se0.35Te0.25+x Cu glasses with x=0.05, 0.075, 0.10, 0.125, and 0.15, as well as dual-source coevaporation from As-chalcogenide and Cu-chalcogenide binary glasses as source materials, has been explored. We have shown that it is...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...