A simple process for forming sub-micron gaps between horizontal and vertical electrodes in a three-dimensional micro-electrode system without the need for high-resolution lithography is described. The process is based on the enhancement of ion milling rates in metals at oblique ion incidence, which allows the preferential erosion of metal at a mesa edge. Self-aligned electrode structures are fo...

MTF measurement methods for imaging devices usually require the use of an optical system to project the image of the object onto the detector. So, MTF results quality strongly depends on the accuracy of the optical adjustments (alignments, focusing...). Dedicated edge patterns have been implemented at the chip level on a CMOS imager. One of them emulates the target used in the ISO 12233 slanted...