Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic compounds (IMC) at the wire/pad interfaces...

Detailed density functional theory (DFT) calculations of the adsorption energies (Ead) for oxygen on monolayer Pd on top of the Pd-Cu face-centered cubic (FCC) alloy and intermetallic B2 structure revealed a linear correspondence between the adsorption energies and the d-band center position. The calculated barrier (Ebarrier) for oxygen dissociation depends linearly on the reaction energy diffe...

Bulk metallic glasses (BMGs) and nanocrystalline metals (NMs) have been extensively investigated due to their superior strengths and elastic limits. Despite these excellent mechanical properties, low ductility at room temperature and poor microstructural stability at elevated temperatures often limit their practical applications. Thus, there is a need for a metallic material system that can ove...

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermet...

Intermetallic compounds are increasingly being expected to be utilized in tribological environments, but to date their implementation is hindered by insufficient ductility at low and medium temperatures. This paper presents a novel multiphase intermetallic alloy with the chemical composition of Mo-40Ni-13Si (at %). Microstructure characterization reveals that a certain amount of ductile Mo phas...

abstractin this paper, we investigate effect of fe–intermetallic compounds on plastic deformation of closed-cell composite aluminum foam as filler of thin-walled tubes. however, deformation of the aluminum foam-filled thin-walled tubes as crushed-box will be presented in part (ii). composite foams of alsi7sic3 and alsi7sic3-(fe) as closed cell were synthesized by powder metallurgy foaming metho...

The past two decades have seen alloys based upon intermetallic phases evolve from the status of scientifically interesting materials with a range of attractive properties, combined with overriding disadvantages, to that of the next generation of advanced engineering alloys. This evolution, which has been achieved through a very significant research and development effort on a world wide front, ...

The thermodynamics of electrochemical and complexation reactions involving the heterobimetallic triple-stranded helicates [MA(L5)3]n+ (M=Ru(II), Cr(III) and A=Ca(II), Lu(III)) reveal that solvation processes mask intramolecular intermetallic repulsions in solution, a phenomenon at the origin of the surprising stabilities of highly charged self-assembled polymetallic complexes in solution. A jud...