In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

The magnetic structure of the localized-5f uranium intermetallic compound U3Pd20Si6 has been determined by means of a neutron diffraction experiment. Our data demonstrate that this compound has a collinear coupling of the sublattice ordering of the uranium spins on the 4a and 8c sites. We conclude that higher-order exchange and/or quadrupole interactions are necessary to stabilize this unique c...

The search for new hard materials is often challenging, but strongly motivated by the vast application potential such materials hold. Ti3Au exhibits high hardness values (about four times those of pure Ti and most steel alloys), reduced coefficient of friction and wear rates, and biocompatibility, all of which are optimal traits for orthopedic, dental, and prosthetic applications. In addition, ...

The first-principle calculations were performed to investigate the structural, mechanical, electronic and thermal properties of the binary ductile intermetallic compound CeAg with B2 (CsCl) structure. The calculated value of lattice constant a0 for CeAg with generalized gradient approximation is 3.713 Å, which is in better agreement with experimental data than local spin density approximation. ...

Erratum: Griffiths phase behaviour in a frustrated antiferromagnetic intermetallic compound Krishanu Ghosh, Chandan Mazumdar, R. Ranganathan & S. Mukherjee Scientific Reports 5:15801; doi: 10.1038/srep15801; published online 30 October 2015; updated on 02 February 2016 This Article contains errors in Figure 4 and Figure 5. In Figure 4, the y-axis ‘M (μ B/f.u.)’ was incorrectly given as ‘M(·B/f....

The rare coexistence of a Griffiths phase (GP) and a geometrically frustrated antiferromagnetism in the non-stoichiometric intermetallic compound GdFe0.17Sn2 (the paramagnetic Weiss temperature θp ~ -59 K) is reported in this work. The compound forms in the Cmcm space group with large structural anisotropy (b/c ~ 4). Interestingly, all the atoms in the unit cell possess the same point group sym...

We introduced a continuum method for modeling of intermediate phase growth and numerically simulated three common experimental situations relevant to the physical metallurgy of soldering: growth of intermetallic compound layer from an unlimited amount of liquid and solid solders and growth of the compound from limited amounts of liquid solder. We found qualitative agreements with the experiment...