the accumulative roll bonding (arb) as a severe plastic deformation (spd) procedure aimed at enhancing the mechanical properties of metals and alloys. in the present study, a new slab method is proposed for estimating the forming stress field for cold extrusion of metals cross the alumina interlayer powder particles by accumulative roll bonding process. plastic deformation behavior of the metal...

This chapter provides an overview of a hybrid metal/polymer wafer bonding plat-form using damascene-patterned intermediate layers for wafer bonding and elec-trical interconnections. This hybrid bonding platform combines the advantagesof metal-to-metal bonding (for direct electrical interstrata interconnection) andpolymer bonding (for robust thermomechanical wafer bonding strengt...

The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through photolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist), AZ-4620 (positive photoresist), SP341 (poly...

objective: the purpose of the study was to evaluate the influence of adding nanofiller particles to a dentin bonding agent on resin-dentin bond strength. materials and methods: fifty-four human intact premolar teeth were divided in to 6 groups of nine. the teeth were ground on occlusal surfaces and polished with 320 and then 600 grit silicon carbide papers. an experimental bonding system based ...